Securities agency analysis means that Intel is on observe to garner chip manufacturing and packaging orders from Apple, Broadcom, Google, and possibly even Nvidia
If anybody has been pondering that Intel was in bother, they could wish to suppose once more, at the least if experiences about its order books for the following few years are something to go by. That is as a result of its chip-making and die-packaging companies seem to have captured the curiosity of Apple, Broadcom, and Google for future processors and different semiconductor units.
That is all in accordance with a report by GF Securities HK Brokerage Ltd, with Jukan on X providing a key snippet. One specific desk reveals Intel’s 18A-P and 14A course of nodes, in addition to its EMIB (Embedded Multi-die Interconnect Bridge) packaging know-how, being utilized by Apple for a ‘smartphone SoC’ and a non-specified ASIC, in addition to Google for a future tensor processing unit (TPU), plus a number of others.
I didn’t see this coming…It appears like Apple’s ASIC—and an unidentified Broadcom ASIC as properly—could also be utilizing Intel for back-end packaging. https://t.co/zidXMELTOa pic.twitter.com/gt3Y1OKTTBDecember 18, 2025
One other put up by Jukan additionally reveals commentary from GF Securities that claims AMD and Nvidia are contemplating Intel’s 14A course of node for his or her server SKUs, although the precise wording of “we proceed to anticipate the probably engagement” is fairly non-commital.
However even when solely a fraction of that is true, it is actually excellent news for Intel, because it at the moment has only a few clients for its foundry companies past, properly… itself. We already know that its forthcoming Panther Lake chips will, partly, be manufactured on the 18A course of node, and the huge Nova Lake processors are probably to make use of it extra extensively as properly. However that is just about it for the foundry’s newest manufacturing tech.
Intel’s 14A remains to be a number of years away from being totally up-and-running for chip making, so even when all these orders do go forward, it will not considerably assist the corporate’s financials to start with. But when Intel does handle to safe chip and packaging orders from Apple, et al then the times of the foundry service making enormous losses are certainly numbered.
GFHK: We see a excessive probability that NVIDIA and AMD’s server SKUs will use Intel 14A.PTL yields reached 60–65% as of November, and the goal is 70% by the top of 2025.$INTC pic.twitter.com/K6pcx7gakrDecember 18, 2025
As issues at the moment stand, the vast majority of high-end processors are made by TSMC, with Samsung in a really distant second place, and because the present DRAM disaster proves, having all of your silicon eggs in a single photolithographic basket just isn’t good for stability and competitors.
Many readers shall be accustomed to the ‘Intel inside’ sticker that has adorned many a PC over time. Maybe by the top of the last decade, we’ll see a model of this utilized to packing containers for telephones, community switches, and even CPUs from AMD and Nvidia. Stranger issues have occurred on the planet of tech, that is for certain.
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