To satisfy 'super and humongous demand' from AI clients, SK Hynix accelerates 2027 fab plans by three months, with an excellent more energizing fab starting wafer manufacturing subsequent month

We already knew SK Hynix had a number of new reminiscence chip fabs within the works, however completion of any of them was nonetheless too far off to know in the event that they’d have any tangible impact on the raging reminiscence provide disaster. Effectively, the main reminiscence maker has simply introduced its intentions to speed up building plans for one fab by three months, now aiming to complete up in February 2027. Moreover, an already-existing fab is anticipated to begin churning out wafers as quickly as subsequent month.

This follows information earlier this week that the South Korean reminiscence producer deliberate to take a position an additional 19 trillion received (or $12.90 billion) into one other superior chip packaging facility in Cheongju. The corporate introduced in December that it deliberate “to take a position roughly 30% of our gross sales in services in 2026 and speed up the transition to 1c DRAM, however it is going to be troublesome to resolve the provision scarcity.”